REDMI 13(8+256GB) TDRA PHONE

NETWORK Technology
GSM / HSPA / LTE
LAUNCH Announced 2024, June 03
Status Available. Released 2024, June 03
BODY Dimensions 168.6 x 76.3 x 8.3 mm (6.64 x 3.00 x 0.33 in)
Weight 205 g (7.23 oz)
Build Glass front, plastic frame, glass back
SIM Hybrid Dual SIM (Nano-SIM, dual stand-by)
IP53, dust and splash resistant
DISPLAY Type IPS LCD, 90Hz, 550 nits (HBM)
Size 6.79 inches, 109.5 cm2 (~85.1% screen-to-body ratio)
Resolution 1080 x 2460 pixels (~396 ppi density)
Protection Corning Gorilla Glass
PLATFORM OS Android 14, HyperOS
Chipset Mediatek Helio G91 Ultra (12 nm)
CPU Octa-core (2×2.0 GHz Cortex-A75 & 6×1.8 GHz Cortex-A55)
GPU Mali-G52 MC2
MEMORY Card slot microSDXC (uses shared SIM slot)
Internal 128GB 6GB RAM, 128GB 8GB RAM, 256GB 8GB RAM
eMMC 5.1
MAIN CAMERA Dual 108 MP, f/1.8, (wide), 1/1.67″, 0.64µm, PDAF
2 MP, f/2.4, (macro)
Features LED flash, HDR
Video 1080p@30fps
SELFIE CAMERA Single 13 MP, f/2.5, (wide)
Features HDR
Video 1080p@30fps
SOUND Loudspeaker Yes
3.5mm jack Yes
COMMS WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.4, A2DP, LE
Positioning GPS, GLONASS, GALILEO, BDS
NFC Yes (market/region dependent)
Infrared port Yes
Radio FM radio
USB USB Type-C
FEATURES Sensors Fingerprint (side-mounted), accelerometer, compass
Virtual proximity sensing
BATTERY Type 5030 mAh, non-removable
Charging 33W wired
MISC Colors Midnight Black, Sandy Gold, Ocean Blue, Pink